How thick will the nickel layer be deposited on the kettle in 2 hours of nickel plating if the current density is 40A / m ^ 2?

Given: t (duration of kettle nickel plating) = 2 hours (in SI t = 7200 s); j (current density) = 40 A / m2.

Constants: k (electrochemical equivalent of nickel) = 30.4 * 10-8 kg / C; ρн (nickel density) = 8900 kg / m3.

We express the thickness of the nickel layer deposited on the teapot from the formula: m = ρн * V = k * I * t = k * j * S * t = k * j * (V / h) * t and h = k * j * t / ρн.

Let’s make a calculation: h = 30.4 * 10-8 * 40 * 7200/8900 = 9.84 * 10-6 m = 9.84 microns.

Answer: A layer of nickel with a thickness of 9.84 microns will be deposited.